工藝產能
Process capability
制程
Process
|
項目
Item
|
通常
Normal Capability
|
改進
Advanced capability
|
|
| 內層 Inner layer | 內層線路
Inner layer exposure |
最小板厚（不含銅）
Min. board thickness (without Cu)
|
0.075mm | 0.05mm |
對位公差
Registration tolerance
|
+/-2mil | +/-1.5mil | ||
內層銅厚
Inner copper thickness
|
2OZ | 3OZ | ||
線寬/線距
wire width/space
|
4/4mil | 3/3mil | ||
內層孔到線間距
Inner layer hole to wire |
4層
4L
|
7mil | 6mil | |
6層
6L
|
8mil | 7mil | ||
8層
8L
|
9mil | 8mil | ||
10層及以上
10L& above
|
10mil | 9mil | ||
壓合
Lamination |
最大層數
Max layer count
|
10L | 12L | |
層間對準度
Layer to lay registration
|
+/-4mil | +/-3mil | ||
銅箔厚度
Copper foil thickness
|
0.5OZ~3OZ | 1/3OZ-3oz | ||
介電層厚度公差
Dielectric layer thickness tolerance
|
±10% | ±8% | ||
鉆孔
Drilling |
最大鉆孔孔徑
Max. drilling size
|
6.0mm | 6.5mm | |
最小鉆孔孔徑
Min drilling size
|
0.25mm | 0.2mm | ||
孔位精度公差
Drilling hole tolerance
|
+/-3mil | +/-2mil | ||
NPTH 孔徑公差
NPTH hole size tolerance
|
+0/-0.05mm | +0/-0.025mm | ||
PTH 孔徑公差（完成）
PTH hole size tolerance (finished)
|
+/-3mil | +/-2mil | ||
孔壁粗糙度
Hole roughness
|
25μm | 20μm | ||
沉銅電鍍
PTH |
生產孔徑(最小)
Hole size (Min)
|
0.25mm | 0.2mm | |
縱橫比(最大)
Aspect ratio(Max)
|
8:1 | 10：1 | ||
線路
Image transfer |
外層最大銅厚
Max. Cu thickness
|
3OZ | 4OZ | |
干膜最大封孔能力
Dry film tenting
|
4.5mm | 6.0mm | ||
對位公差
registration tolerance
|
+/-2mil | +/-1.5mil | ||
線寬/線距 (底銅0.5OZ)
Wire Width/Space (base Cu 0.5OZ)
|
4/4mil (底銅0.5OZ) | 3/3mil | ||
阻焊
Solder mask |
綠油橋最小寬度
Min. Solder bar
|
4mil | 3mil | |
綠油厚度
Soler mask thickness
|
線角≧7μm，(line corner)
線面≧10μm (line surface)
|
線角≧7μm，(line corner)
線面≧10μm (line surface)
|
||
對位公差
Registration tolerance
|
+/-2mil | +/-1.5mil | ||
塞孔最大孔徑
Hole plugging size
|
0.45mm | 0.55mm | ||
SMT PAD之間最小距離
Min. PAD space
|
7mil | 6mil | ||
字符
Legend |
最小線寬線距
Min. line width/space
|
4mil/4mil | 3.5mil/3.5mil | |
白字最小內徑
Inner diameter of digital
|
8mil | 7mil | ||
碳油
Carbon ink |
碳油方阻
Rectangular resistance
|
≤40ohm | ≤30ohm | |
印油PAD最小間距
Min carbon ink space
|
30mil | 25mil | ||
成型
Routing |
鑼板尺寸公差
Routing tolerance
|
+/-4mil | +/-3mil | |
最小鑼刀
Min routing bit
|
0.8mm | 0.7mm | ||
槽位到鑼邊距離
routing slot to side
|
≥10mil(0.25mm) | ≥8mil(0.2mm) | ||
啤板
Punching |
啤板尺寸公差
Punching tolerance
|
+/-4mil | +/-3mil | |
孔到邊精度
hole to side
|
±5mil (0.125mm) | ±4mil (0.1mm) | ||
| V-CUT | 上、下V坑線對準度
Leveling of top/bottom V-cut line
|
±4mil (0.1mm) | ± 3mil (0.075mm) | |
余厚控制精度
web thickness
|
±4mil (0.1mm) | ± 3mil (0.075mm) | ||
V坑位置公差
V-Cut position
|
±4mil (0.1mm) | ± 3mil (0.075mm) | ||
電測試
E-testing
|
測試最小PAD
Min testing PAD
|
10mil | 8mil | |
表面處理
Surface finish |
OSP厚度
OSP film thickness
|
0.2-0.5μm | 0.25-0.5μm | |
沉錫厚度
Immersion Tin thickness
|
0.8-1.2μm | 1.0-1.2μm | ||
沉銀厚度
Immersion Ag thickness
|
0.1-0.3μm | 0.2-0.3μm | ||
化金厚度
Immersion Au thickness
|
1-2.5μ＂ | 1-2.5μ＂ | ||
沉鎳厚度
Immersion Nick thickness
|
120-250μ＂ | 160-250μ＂ | ||
有鉛噴錫厚度
HASL (Pb)
|
1-40μm | 2-40μm | ||
無鉛噴錫厚度
HASL (Pb free)
|
1-40μm | 2-40μm | ||
其它能力
Other |
阻抗控制
Impedance tolerance
|
±10% | ±8% | |
板彎板曲
Board warpage/twist
|
0.75% | 0.50% | ||
| 內外層線寬公差 | ±20% | ±15% | ||
外層最大板尺寸
Max Board size
|
610x450mm | 630x510mm | ||
外層最小板尺寸
Min. board size
|
75*75mm | 50*50mm | ||
外層最大板厚
Max board thickness
|
2.5mm | 3.2mm | ||
外層最小板厚
Min board thickness
|
0.4mm | 0.3mm | ||
